| 583 | publisher      = {U.S. Department of Commerce}, | publisher      = {U.S. Department of Commerce}, | 
| 584 | address        = {Washington, D.C. (USA)}, | address        = {Washington, D.C. (USA)}, | 
| 585 | note           = {http:////ingrid.ldeo.columbia.edu/SOURCES/.DASILVA/.SMD94/}, | note           = {http:////ingrid.ldeo.columbia.edu/SOURCES/.DASILVA/.SMD94/}, | 
| 586 |  | url            = {http:////ingrid.ldeo.columbia.edu/SOURCES/.DASILVA/.SMD94/}, | 
| 587 | } | } | 
| 588 |  |  | 
| 589 | @techreport{sta-eta:97, | @techreport{sta-eta:97, | 
| 809 | journal =      om, | journal =      om, | 
| 810 | year =         2004, | year =         2004, | 
| 811 | volume =       7, | volume =       7, | 
| 812 | pages =        {269-284} | pages =        {269-284}, | 
| 813 |  | doi   =        {10.1016/j.ocemod.2003.09.003}, | 
| 814 | } | } | 
| 815 |  |  | 
| 816 | @Article{adcroft:04b, | @Article{adcroft:04b, |